Microchannel Cooler Analysis and Optimization

The TFL is analyzing and optimizing a microchannel cooler for a laser diode application, collaborating with nLight Photonics and the Washington Technology Center . Fluent CFD software was used to simulate the fluid flow and heat transfer for a commercially-designed microchannel cooler (D h = 300 microns). Initial results showed that the previous channel design had significant flow asymmetry and pressure loss, and a subsequent optimization improved the flow and heat transfer performance of the microchannels. In addition, a two-phase fluid design is being developed to further increase allowable heat loads. These new designs will be examined using micro-PIV flow visualization and prototype performance experiments, permitting validation of the CFD simulations and further system improvements.

Groove Enhancement of Micro-channels

Although micro-channel technology can remove significant heat loads from electronics devices, even this method is being stretched to its limit by modern power dissipation levels. Micro-scale enhancements could potentially extend traditional designs beyond their current range to meet future thermal loads.  One promising macro-scale method is to use dimpled or grooved surfaces to enhance mixing in the flow, increasing the heat transfer without a large pressure penalty. Simulations are currently being performed to examine the flow and thermal response of grooved channel surfaces, and these results will be used to optimize designs for electronics cooling. These optimal designs will be fabricated using advanced MEMS techniques, and micro-PIV methods will be used to validate the computational results and improve on the design.