Device Diagnostics and Microelectronics Laboratory

 

Veeco CPII Scanning Probe Microscope with 100 micron Scanner and On-axis Optical Microscope

  • Performs contact, lateral force microscopy, tapping mode, phaseimaging, and Scanning Tunneling microscopy
  • Capable of performing liquid imaging, force modulation, magnetic force, ,electric field, surface potential, scanning capacitance, scanning thermal microscopy, nanomanipulation, conductive AFM and nanolithography with additional hardware and/or software accessories
  • Accepts samples up to 50mm diameter and 25mm thick
  • Supports ScanMaster closed loop scan linearization and position control system
     

Aspex Personal Scanning Electron Microscope (SEM)

  • 5kV to 20 kV power
  • 20X to 200kX continuous magnification
  • Removable and interchangeable stage
  • Secondary and backscatter imaging capable
  • Auto focus, contrast and brightness
  • Feature measurement capability
  • Energy Dispersive X-ray analysis (EDX) system
  • Motorized computer controlled x, y stage
  • Motorized computer controlled tilt/rotate stage
  • 4 segment multichannel backscatter detector
 
     

Nikon Compound Microscope

  • 5x to 100x objective lenses
  • Brightfield, darkfield, and Nomarski image capable
  • 3-level focus capability (rapid, course and fine) minimum 125mm of focus travel, built in scale for z-axis measurement
  • Stage travel 6” x 4”
  • Measurement stage with a minimum 100mm x 100mm stroke and .0005 mm resolution
  • Rotating table
  • 3 axis digital readout (DRO) capable of in or mm with 0.0005 mm resolution
  • Digital camera with Nikon capture software able to save in multiple file formats and annotate images
 
     

Phoenix X-ray Microscope

  • Closed tube 100kV with high contrast 6” dual field image intensifier with high resolution CCD camera
  • Auto positioning system (CNC) with a tilt and rotate unit
  • Sample size of 28” x 22”, X-Y Scanning area of 24” x 18”
 
     

Clean Room Equipment

  • Perkin Elmer Sputter Machine capable of etching and multiple coating deposits to include copper, titanium, silicon oxide, and aluminum
  • Rocye Ball and shear tester
  • Ball Bonder
  • OGI photolithography capable of 5” mask